- Tailored turnkey solution
- Production analysis
- Component procurement and management
- Complete or partial
- Printed circuit board production and assembly
- Tests (functional and ICT) and chip programming
- Trouble shooting, repair and rework
- Coating and potting
- Mechanical assembly, integration and packaging
- Assembly capacity
- Surface mount technology (SMT), through-hole circuit assembly and mixed technology
- Fine pitch, 0201 components, Micro BGA, PCB high density, flip chip
- Double sided assembly
- Small quantities (500) and mass production
- Prototypes
- Validation units (5 to 20)
- Lead-free (RoHS) or with lead solder technology
- Quality
- ISO 9001 certified: Version 2000
- IPC-A-610 class II and class III Workmanship Standard
- Other services
- Harness and cables
- Plastic casings – Plastic injection molding
- Metal casings
